Thin Film Measurement :

Production processes are evolving rapidly which is reflected in a growing need for high-grade evaluation and analysis of a wide range of thin films and complex multilayer structures. HORIBA systems are capable of measuring film properties including stress, thickness and optical constants of complex and multilayer films and ultra-thin SiO2 films.

Plasma Diagnosis Endpoint Monitor EV-140C
Real Time Interferometric Process Monitor DIGILEM-CPM-Xe/Halogen
Real Time Interferometric Process Monitor LEM-CT-670-G50